Bhadra? Vertical Low-Temperature Alloying Furnace BLA200
Advantage
Function: Mainly used in 8-inch medium and low temperature alloy process, inert gas is passed under low temperature condition to release the stress between the layers, forming a good interlayer contact surface, reducing the resistance of the interlayer contact surface, and realizing high degree of automation in the process.
Consultationor call:
86-18924169069 / 020-31569374
Technical Parameters
Wafer size: 8 inches
Process types: Alloy, PI Cure
Compatible material: Silicon
Application fields: Power semiconductors, IC, Research